server { location ~ /ads.txt { return 301 https://srv.adstxtmanager.com/19390/extecnology.blogspot.com; } } The socket is the motherboard, Part 2 — Intel archrival (and Nvidia's BFF) plans to build giant chips that could use kilowatts of power but they won't be as big as Cerebras trillion transistor behemoth

The socket is the motherboard, Part 2 — Intel archrival (and Nvidia's BFF) plans to build giant chips that could use kilowatts of power but they won't be as big as Cerebras trillion transistor behemoth

Angela B. Gagnon

Angela B. Gagnon

May 11, 2024

0

TSMC has announced plans to create giant system-in-packages (SiPs) based on its chip-on-wafer-on-substrate (CoWoS) packaging technology.

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